Coining Acquires SPM

SEMX Corporation, parent of SPM, is pleased to announce it has been acquired by Coining, Inc. of Saddle Brook, NJ. Coining is the largest manufacturer of solder and brazing preforms for microelectronic packaging and assembly worldwide.

Please visit the Coining website for additional details.
www.coininginc.com

Semiconductor Packaging Materials, Inc (SPM)
SPM offers advanced metal materials including Bonding Wire, Bonding Ribbon, Eutectic Solder preforms (Die Attach), Metal Clad Materials, and Precision Metal Stampings for automotive, medical, and electronic packaging applications.

Contract Packaging Services
Highly automated, cost effective placements of your components into waffle pack or tape on reel is available at any of our 3 global locations (USA, Morocco, or Malaysia)

	1 Labriola Court Armonk NY, 10504 Phone: (914) 273-5500 Fax: (914) 273 5860 E-Mail: info@semx.com